Symposia & Forums

Symposium D-7
Functional Surface Science & Engineering

Organizers

Representative

Hideo HONMA
Kanto Gakuin University, Materials & Surface Engineering Research Institute

Co-Organizers

Hideo HONMA
Kanto Gakuin University, Materials & Surface Engineering Research Institute
Hitoshi KATO
Kanto Gakuin University, Department of Electrical, Electronic and Information Engineering
Chris CORDONIER
Kanto Gakuin University, Materials & Surface Engineering Research Institute
Shrikant JOSHI
International Advanced research Centre for Powder Metallurgy & New Materials (ARCI)

Correspondence

Chris CORDONIER
Kanto Gakuin University, Materials & Surface Engineering Research Institute（chris@kanto-gakuin.ac.jp）
Hitoshi KATO
Kanto Gakuin University, Department of Electrical, Electronic and Information Engineering（hkato@kanto-gakuin.ac.jp）

Scope

Functional surface science and engineering entails formation methods and mechanisms of, analysis and chemistry of, and application of films, interfaces and functionalized surfaces. This includes surface treatment or film formation by chemical or physical interactions such as surface modification by reaction with plasma or active oxygen, SAMs, coating, adsorption of chemicals or plating for example. This symposium also includes study of chemical and physical properties of functional surfaces as well as application. Fine patterning techniques and application of patterned films and surfaces for example patterned hydrophilic/hydrophobic surfaces, photopatterning, and direct pattern plating. This symposium also focuses on electroless and electroplating nickel, copper, silver, gold, alloys, and composites etc., including techniques, chemistry, use in fabrication and application of novel plated films. Related device design and engineering are also included in the scope.

Topics

  1. Functional Materials & Surface Engineering
  2. Nano Materials & Technology
  3. Wet & Dry Processed Thin Films
  4. Plating Technology
  5. Nano-micro Patterning
  6. Electronic, Semiconductor and Optical Device Fabrication
  7. Electronic and Semiconductor Device Packaging

Invited Speakers

Hu SHU-FEN
National Taiwan Normal University, Taiwan
Dow WEI-PING
National Chung Hsing University, Taiwan